cld ds-30 rev 1 product family data sheet copyright ? 2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. www. cree.com/xlamp cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 cree ? xlamp ? ml-e leds product description the cree xlamp ml-e led brings lighting-class reliability and per - formance to 1/2-watt leds. the xlamp ml-e expands crees light - ing-class leadership to linear and distributed lighting applications. with xlamp lighting-class reliabil - ity, a wide viewing angle, uniform light output, and industry-leading chromaticity binning in a 3.5-mm x 3.5-mm package, the xlamp ml-e led continues crees history of segment-focused product inno - vation in leds for lighting applica - tions. the xlamp ml-e led brings high performance and a smooth look to a wide range of lighting applica - tions, including linear lighting, led light bulbs, fuorescent retrofts and retail-display lighting. features ? available in white (2,600 k to 8,300 k cct) ? ansi-compatible sub-bins ? maximum drive current: 500 ma ? 120 viewing angle, uniform chromaticity profile ? electrically neutral thermal path ? rohs and reach-compliant ? unlimited foor life at 30c/85% rh table of contents flux characteristics (t j = 25c ) . . . . . . 2 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 relative spectral power distribution . . . . . . . . . . . . . . . . . . . . . . . . . . 3 relative flux vs. junction temperature (i f = 150 ma) . . . . . . . . 3 electrical characteristics (t j = 25c) . . . . . . . . . . . . . . . . . . . . . . . . . . 4 relative flux vs. current t j = 25c) . . . . . . . . . . . . . . . . . . . . . . . . . . 4 thermal design . . . . . . . . . . . . . . . . . . . . . . . . . 5 typical spatial distribution . . . . . . . . . . . . 5 refow soldering characteristics . . . . . . 6 notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 mechanical dimensions (t a = 25c).. 8 tape and reel . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
copyright ? 2010, 2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. 2 xlamp ml-e leds flux characteristics (t j = 25c) the following table provides several base order codes for xlamp ml-e leds. it is important to note that the base order codes listed here are a subset of the total available order codes for the product family. for more order codes, as well as a complete description of the order-code nomenclature, please consult the xlamp ml-e led binning and labeling document. color cct range base order codes min luminous flux (lm) @ 150 ma order code min. max. group flux (lm) cool white 5.000 k 8,300k m3 45.7 mleawt-a1-0000-000351 n2 51.7 mleawt-a1-0000-000451 warm white 3,700 k 4,300 k m2 39.8 mleawt-a1-0000-0002e5 m3 45.7 mleawt-a1-0000-0003e5 2,800 k 3,200 k k3 35.2 mleawt-a1-0000-0001e7 m2 39.8 MLEAWT-A1-0000-0002E7 notes: ? cree maintains a tolerance of +/- 7% on fux measurements. ? typical cri for cool white (4,300 k C 8,300 k cct) is 75. ? typical cri for warm white (2,600 k C 4,300 k cct) is 80. characteristics characteristics unit minimum typical maximum thermal resistance, junction to solder point c/w 11 viewing angle (fwhm) degrees 120 temperature coeffcient of voltage mv/c -3 esd classifcation (hbm per mil-std-883d) class 2 dc forward current ma 150 500 reverse voltage v 5 forward voltage (@ 150 ma) v 3.2 3.4 led junction temperature c 150
copyright ? 2010, 2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. 3 xlamp ml-e leds relative spectral power distribution relative flux vs. junction temperature (i f = 150 ma) relative spectral power ml-e - ok 0 20 40 60 80 100 400 450 500 550 600 650 700 750 relative radiant power (%) wavelength (nm) 5000k - 8300k cct 3500k - 5000k cct 2600k - 3500k cct 0% 20% 40% 60% 80% 100% 120% 25 45 65 85 105 125 145 relative luminous flux junction temperature (oc)
copyright ? 2010, 2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. 4 xlamp ml-e leds electrical characteristics (t j = 25c) relative flux vs. current (t j = 25c) 0 50 100 150 200 250 300 350 400 450 500 2.50 2.75 3.00 3.25 3.50 3.75 4.00 forward current (ma) forward voltage (v) 0% 50% 100% 150% 200% 250% 300% 0 100 200 300 400 500 relative luminous flux (%) forward current (ma)
copyright ? 2010, 2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. 5 xlamp ml-e leds thermal design the maximum forward current is determined by the thermal resistance between the led junction and ambient. it is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. typical spatial distribution 0 100 200 300 400 500 600 0 25 50 75 100 125 150 maximum current (ma) ambient temperature (oc) rj - a = 20 c/w rj - a = 30 c/w rj - a = 40 c/w rj - a = 50 c/w 0 20 40 60 80 100 120 - 100 - 80 - 60 - 40 - 20 0 20 40 60 80 100 relative luminous intensity (%) angle (o)
copyright ? 2010, 2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. 6 xlamp ml-e leds reflow soldering characteristics in testing, cree has found xlamp ml-e leds to be compatible with jedec j-std-020c, using the parameters listed below. as a general guideline, cree recommends that users follow the recommended soldering profle provided by the manufacturer of solder paste used. note that this general guideline may not apply to all pcb designs and confgurations of refow soldering equipment. profle feature lead-based solder lead-free solder average ramp-up rate (ts max to tp) 3c/second max. 3c/second max. preheat: temperature min (ts min ) 100c 150c preheat: temperature max (ts max ) 150c 200c preheat: time (ts min to ts max ) 60-120 seconds 60-180 seconds time maintained above: temperature (t l ) 183c 217c time maintained above: time (t l ) 60-150 seconds 60-150 seconds peak/classifcation temperature (tp) 215c 260c time within 5c of actual peak temperature (tp) 10-30 seconds 20-40 seconds ramp-down rate 6c/second max. 6c/second max time 25c to peak temperature 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package, measured on the package body surface. note: while the high refow temperatures (above) have been approved, crees best practice guideline for refow is to use as low a temperature as possible during the refow soldering process for these leds.
copyright ? 2010, 2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. 7 xlamp ml-e leds notes moisture sensitivity in testing, cree has found xlamp ml-e leds to have unlimited foor life in conditions 30oc / 85% relative humidity (rh). moisture testing included a 168 hour soak at 85oc / 85% rh followed by 3 refow cycles, with visual and electrical inspections at each stage. rohs compliance the levels of environmentally sensitive, persistent biologically toxic (pbt), persistent organic pollutants (pop), or other - wise restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with eu directive 2002/95/ ec on the restriction of the use of certain hazardous substances in electrical and electronic equipment (rohs), as amended through april 21, 2006. vision advisory claim users should be cautioned not to stare at the light of this led product. the bright light can damage the ey e.
copyright ? 2010, 2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. 8 xlamp ml-e leds mechanical dimensions (t a = 25c) all measurements are .13 mm unless otherwise indicated. recommended fr4 solder pad mx3535 pad layout top view bottom view side view top view recommended mcpcb solder pad alternative solder pad
copyright ? 2010, 2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. 9 xlamp ml-e leds tape and reel all dimensions in mm. loaded pockets (1,000 lamps) leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) start end cathode side anode side (denoted by + and circle) 160.0 a a b 2.5 .1 section a-a scale 2 : 1 1.5 .1 8.0 .1 4.0 .1 1.75 .10 12.0 .0 + .3 detail b scale 2 : 1 13 mm 7" cover tape pocket tape user feed direction user feed direction start end user feed direction
copyright ? 2010, 2011 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trade - marks of cree, inc. 10 xlamp ml-e leds cree bin code & barcode label vacuum-sealed moisture barrier bag label with customer p/n, qty, lot #, po # label with cree bin code, q t y , lot # label with cree bin code, q t y , lot # v acuum - sealed moisture barrier bag p atent label label with customer order code, q t y , r eel i d , po # packaging all dimensions in mm.
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